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Upcoming centers poised to revolutionize microelectronics technologies


Los Alamos National Laboratory is leading a groundbreaking project aimed at revolutionizing the design and fabrication of integrated circuits. The project, known as Nano Solutions On-Chip (NSOC), focuses on addressing challenges in energy efficiency and robust operation in extreme environments crucial for national security.

Led by scientist Jennifer Hollingsworth, the project will explore the use of nanoscale semiconductors, such as quantum dots, to create devices that utilize photons as carriers of information in addition to electrons. This new approach could significantly improve energy efficiency and manufacturing processes, as well as enhance the tolerance of integrated circuits to radiation effects.

The NSOC project is part of a larger initiative called CHIME, which aims to advance extreme-environment electronics and device design. This initiative, which includes three other projects, will investigate heterogenous integration techniques to optimize performance in challenging conditions. Hollingsworth will serve as the first chair of CHIME, further solidifying New Mexico’s role in cutting-edge technology and innovation.

Partnering institutions in the NSOC project include the University of Pennsylvania, Columbia University, the University of Wisconsin-Madison, Duke University, and Sandia National Laboratories. The collaboration between these institutions and Los Alamos National Laboratory highlights the importance of addressing energy efficiency and extreme environment operation in microelectronics.

The establishment of CHIME and the Microelectronics Energy Efficiency Research Center for Advanced Technologies underscores New Mexico’s leadership in semiconductor technology and its commitment to translating research into scalable, manufacturable solutions to meet critical societal and industrial needs. This project marks a significant step towards revolutionizing the future of integrated circuits.

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